OKI technology could halve size of camera phones

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Semiconductor manufacturer, OKI, has developed a new manufacturing technique which could cut the size of camera modules for mobile phones by 50 percent.

The company has started a contract assembly service for W-CSP (Wafer level Chip Sized Package) semiconductors, which uses innovative through-hole technology.

Further miniaturisation of camera modules requires smaller image sensors. OKI’s new technique creates a through-hole in the silicon substrate such as an image sensor and puts an electrode through the newly made hole.

OKI plans to increase production to 10,000 wafers a month within the year to March 2009, with a further increase to 20,000 wafers per month by the fiscal year ending March 2010, subject to demand.