Tessera first with wafer-level technology for cell-phones

Permalink: Tessera first with wafer-level technology for cell-phones by Jan Harris

Tessera Technologies Inc, a provider of miniaturisation technologies for the electronics industry, has announced OptiML WLC, a wafer-level camera technology which advances the integration of miniaturised cameras in mobile phones and other electronic devices.

The technology makes it possible for cameras to be manufactured at the wafer level, substantially reducing the size of camera modules and also reducing the cost by up to 30%.

With the new technology, thousands of lenses can be manufactured simultaneously on a wafer.

The multiple lens wafers are then aligned and bonded at the wafer level to create the optical element of the camera.

The accuracy of the WaferStack process eliminates the need for costly manual focusing.

The bonded lens wafers are then diced into individual lens modules, and each lens module is mounted on top of a packaged image sensor, giving a camera module that can be mounted directly onto the phone board using a reflow process.

The company’s Eyesquad technology can be easily integrated into the OptiML WLC solution, providing advanced auto-focus and digital optical zoom without the use of moving parts.

The new technology will make its possible to integrate cameras into a wider range of electronic products.